Following several months of integration, the team is proud to announce that the 3rd generation of F.A.S.T. process modules are now smoothly manufactured on our production line
Semicon West 2017
July 11-13, 2017
San Francisco, California
will be glad to welcome you at Semicon West, on our booth #6468
KOBUS will be presenting at the joint EuroCVD – Baltic ALD conference, in Linköping, Sweden.
The talk, entitled “An innovative and flexible deposition technique to fill the gap between ALD and CVD”, will be given Monday 12th of June, in the session New directions in deposition session of the conference.
Meet us there to discuss the topic !
KOBUS will be present at the 5th Micro/Nano-Electronics Packaging and Assembly, Design and manufacturing Forum.
KOBUS will present its latest results and analyses during the following talk:
“Alternative Deposition Solution for Cost Reduction of TSV Integration”
KOBUS will be present at the Advanced Packaging System Integration Technology Symposium.
Key sessions and speakers include:
Fan Out Packaging: from Integration to IP with Huawei, Huatian Technology (Kunshan) Electronics, nepes,…
3D Integration & Processes for Advanced Packaging with BroadPak Corporation, KOBUS,…
Equipment for Advanced Packaging Platforms with Besi, Unity SC,…
Advanced Materials & Processes with Brewer Science, DISCO Corp.,…
Applicative Packaging & Materials with Infineon Technologies, Dow Electronics Materials,…