KOBUS will be present at the 5th Micro/Nano-Electronics Packaging and Assembly, Design and manufacturing Forum.
KOBUS will present its latest results and analyses during the following talk:
“Alternative Deposition Solution for Cost Reduction of TSV Integration”
KOBUS will be present at the Advanced Packaging System Integration Technology Symposium.
Key sessions and speakers include:
Fan Out Packaging: from Integration to IP with Huawei, Huatian Technology (Kunshan) Electronics, nepes,…
3D Integration & Processes for Advanced Packaging with BroadPak Corporation, KOBUS,…
Equipment for Advanced Packaging Platforms with Besi, Unity SC,…
Advanced Materials & Processes with Brewer Science, DISCO Corp.,…
Applicative Packaging & Materials with Infineon Technologies, Dow Electronics Materials,…
KOBUS is proud to announce its participation at the MAM2017 conference.
The latest information concerning the F.A.S.T® technology applied to TSVs will be presented.
Part of the talk will introduce new results on the SiO2 liner deposition, while a second part will focus on the TiN barrier layer.
Pros and cons of the (PE)CVD, (PE)ALD and FAST solutions, all available with a FAST deposition module, will be compared and applied to different aspect ratio vias.
Full abstract of the talk can be found here.
The Materials for Advanced Metallization conference will take place in Dresden, Germany, March 26-29th
EUROPEAN 3D Summit 2017
Jan 23-25, 2017
will be glad to meet you at the European 3D Summit, on our booth #20
Semicon Europa 2016
Oct 25-27, 2016
will be glad to welcome you at Semicon Europa, on our booth #538